BUILDING THE FUTURE...RIGHT NOW!!

SA Electronics INC. using MY DATA equipments and at fully ESD protected facility, offers assembly of single or multi-layer flexible or rigid circuit boards in high density down to 0201(capability to place 01005), BGA, micro BGA and flip chips, whilet still providing conventional through hole assembly or a mixture of both, in single or double sided placement and insertion.

 

•  Rigid and Flexible Circuit Assembly

•  Surface Mount Assembly (0201s to Fine Pitch Devices including Micro BGAs)

•  Through Hole Assembly

•  Hybrid (SMT and Through Hole) Assembly

•  Quick Prototyping, Production and Turnkey Manufacturing

•  Box Build/Mechanical Assembly

•  Conformal Coating

•  In-circuit, functional, and Burn-in testing

•  Wire Harness and Cable Assembly

•  EEPROM Programming

•  Lead-Free Assembly

• Consignment, Turnkey & Hybrid Materials Management

• Controlled Material Attrition with Flexible Set-Up

• Design and Process Verification & Validation

• Documentation Development

• First-Pass Yield on Initial Prototype Complete Test Strategy, Development & Fixture Design

• Manufacturing Transfer, NPI & Production Scale-Up

• Rapid Prototyping Services Design for Manufacturing (DFM)

• Design for Supply Chain & Value Engineering

• Expert PCB Layout

• Product, Process & Quality Engineering

• Production-Compatible Pick & Place Platforms

• Full Systems Test: Flying Probe, Failure Analysis

• AOI, BGA Rework & Re-Balling, Isometric X-Ray