BUILDING THE FUTURE...RIGHT NOW!!
PCB@SAelectronics.org
847-380-3017
We Supply B2B & Personal
25 YEARS OF EXPERIENCE
-
BLIND AND BURIED VIAS
-
RIGID-FLEX & FLEX PCB
-
IPC Class 3 QUALITY
SA Electronics Inc utilizes both automated and manual equipment to assemble low volume PCB assemblies. The production areas are within an ESD and climate controlled environment. Personnel are trained and qualified in IPC-A-610 Workmanship Standards for inspection, IPC JSTD-001 workmanship guidelines for assembly as we work within ESD 2020 guidelines to help in ensuring a quality assembly.
SA Electronics Inc. offers electronic assembly services for single or multi-layer flexible or rigid circuit boards for passives as small as 0201s (capability to place 01005s), BGA and micro BGA, flip chips and leadless devices. These components are placed using our automated assembly equipment. It has the added capability of testing the value of passive resistor and capacitor values as well as diode or trazistors orientation helping insure that the right values are placed at the right locations. We can also perform conventional through hole assembly of mixed technology assembly in single or double sided configuration. Electronic components can be placed on standard rigid, hybrid ceramic, aluminium, rigidflex or flexible circuit boards.
-
Leadless Device Placement (LGA and QFN)
We have extensive experience in placing leadless devices including LGAs and QFNs. We use MY500 MYDATA JETPRINT for print and placement accuracy is critical to insuring that these parts are placed correctly. These packages, which can have solder bumps or lands located on the package, can be placed, x-rayed and reworked.
-
Ball Grid Array (BGA)
We have extensive experience in placing, inspecting, troubleshooting and reworking BGAs. BGA and MicroBGA components are placed using our automated pick-and-place equipment with its vision system. The accuracy and repeatability of this equipment ensures perfect solder joints, down to 0.4mm pitch components. We can place and have experience in assembling ceramic and metal carrier parts onto circuit boards as well as column grid array components. This expertise is backed up with the latest in X-ray technology, and rework systems.